Solidtrust Technologies India Private Limited

Thermo-Mechanical Coupled Simulations (TMCS) model the intricate interplay between heat (thermal) and force (mechanical) fields in materials, where temperature changes affect deformation and stresses, and mechanical loads generate heat, crucial for analyzing real-world scenarios like aerospace, nuclear, and electronics. These simulations use numerical methods (like Finite Element Method or Peridynamics) to solve coupled equations, predicting phenomena like thermal expansion, stress-induced heating (Joule heating), material damage, and failure under extreme conditions, often requiring powerful computational techniques for complex geometries and contact.